DSP Group Deploys CEVA Audio DSP for Voice Enhancement Solution
Feb 28, 2013 (Close-Up Media via COMTEX) --
CEVA, Inc., a licensor of silicon intellectual property (SIP) platform solutions and DSP cores, announced that DSP Group, a global provider of wireless chipset solutions for converged communications, has licensed and deployed the CEVA-TeakLite-III DSP in the latest voice and audio SoC powering its HDClear solution.
According to a release, the DBMD2 SoC enables enhanced noise cancellation and maximizes automatic speech recognition (ASR) accuracy in any environment, isolating voice from surrounding environmental noise, enabling mobile users to use their voice effectively anywhere.
"The CEVA-TeakLite-III DSP provides the perfect balance of ultra-low power and exceptional audio/voice processing for our DBMD2 SoC at the heart of the HDClear solution," said Dr. Arie Heiman, Corporate Vice President and General Manager of HDMobile at DSP Group. "The maturity and robustness of the complete CEVA package, from the DSP implementation through to the CEVA Toolbox software development environment and hardware development kit helped us in reaching our demanding goals."
Eran Briman, vice president of marketing at CEVA, said, "We are pleased to see the quick design turnaround time DSP Group has been able to achieve, with the DBMD2 SoC already available in silicon. The capabilities of their latest HDClear product offering are impressive and firmly position DSP Group on the leading edge of the market for advanced, low power audio/voice platforms. By using the programmable CEVA-TeakLite-III DSP as a foundation, DSP Group enables their customers to differentiate their products via software add-ons and updates, allowing them to evolve and adapt to new market requirements."
DSP Group is a global provider of wireless chipset solutions for converged communications.
CEVA is a licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets.
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