Advantest Debuts New T2000 3Gbps CMOS Image Capture Module
Looking to allow its customers to test the high-frequency, low-power D-PHY and M-PHY interface chips, Advantest Corporation (News
) has unveiled the IC industry's fastest image-capture module.
The new T2000 3Gbps CMOS Image Capture Module is a part of Advantest's T2000 ISS system.
The T2000 3Gbps CMOS
Image Capture Module's main benefit is that it reduces the expenses of testing, by simultaneously examining up to 64 devices in parallel. The module can be used to enhance yields and conduct at-speed testing in production.
And when it comes to verifying semiconductor designs on first silicon, the module can be utilized to reduce turnaround time.
Advantest's new 3GICAP test module is armed with a high-speed image-capture rate of up to 3Gbps. This unique feature allows the tool to perform accurate, largely parallel testing of CMOS image sensors.
These sensors can be used in various consumer electronic devices such as digital cameras, cell phones, video camcorders and automotive vision systems.
"Ongoing, rapid improvements in the performance and resolution of CMOS image sensors as well as the growing volume of electronic products depending upon them continue to exert downward pressure on production costs,' said Satoru Nagumo, senior vice president of the ASD Test Business Group at Advantest Corporation. 'Our newest generation of image-capturing technology enables our customers to lower the cost of test while meeting the performance requirements for advanced image sensors."
Recently, the company developed a new mask defect review tool called the Mask DR-SEM
E5610. According to the company, this enabled the review and classification of ultra-small mistakes in photomask blanks. Developed by Advantest for its acclaimed multi-vision metrology SEM for photomasks, the E5610 inherits the highly stable, fully automatic image capture technology and provides a newly developed beam tilt mechanism that enables scanning at oblique angles.
Edited by Braden Becker
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